Global semiconductor packaging and assembly equipment market was valued $XX Billion in 2018, and is projected to reach $XX Billion by 2026; with a CAGR of XX% from 2019 to 2026. Asia-Pacific is a dominant market holding a major market share, driven by growing demand in China, India, and Japan.
The major factors driving the global semiconductor packaging and assembly equipment market are the increase in the application of semiconductor ICs across many segments and the growth in complexity of semiconductor IC designs. In addition, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs which has fueled the demand in the market. The development of complex semiconductor ICs is expected to strengthen the market in the future years.
The global semiconductor packaging and assembly equipment market is segmented by type, application, and region. The type segment is divided into plating equipment, inspection & dicing equipment, wire bonding equipment, die-bonding equipment, and inspection & dicing equipment. Based on the application, it is classified into consumer electronics, healthcare devices, automotive applications, enterprise storage, industrial applications, and others. By geography, market is segment into North America, Europe, Asia Pacific, and Rest of the World (RoW).
The country-wise analysis has been also covered under the scope of the report. North America covers the U.S., Canada, and Mexico, while Europe covers UK, Germany, France, Italy, and Rest of Europe. China, Japan, India, Korea, and Rest of Asia-Pacific have been analyzed under the Asia-Pacific market. Rest of the world includes Central & South America, the Middle East, and Africa.
The scope of the report covers in-depth analysis of the market in terms of both qualitative and quantitative analysis across the segments as well as cross-sectional analysis of the segments including the geographies and its countries. The market has been analyzed both from demand as well as supply side to come to an accurate scenario. Products across application and application across geographies have been mapped to provide you a precise competitive scenario to have a leading edge in the market.
Key companies operating in this market and their company profile along with the market share analysis and competitive scenario is also the part of the report. Top players in the market are Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group, among others.
The Highlights of the Report
Scope of the Global Semiconductor Packaging and Assembly Equipment Market
• North America
o The U.S.
o Rest of Europe
o Rest of Asia-Pacific
• Rest of the World
o Central & South America
o The Middle East