Wafer Level Packaging (WLP) Market Global Scenario, Market Size, Outlook, Trend, and Forecast, 2019 – 2028


Wafer Level Packaging Market is projected to reach US$13.26 billion by 2028, growing at a CAGR of 16.1 % from 2021 to 2028. Wafer Level Package (WLP) refers to a system of packaging used to interconnect electrical components like resistors, capacitors, transistors, and others on a single chip called Integrated Circuits (ICs) using solder bumps on chip pads. ICs are very brittle and are disposed to contamination. WLP offers many advantages, such as multichip capability, increased I/O density, reduced form factor, improved electrical & mechanical performance, outstanding cost/performance capability, and opportunity for advanced 3D structures, over conventional packaging technologies such as wire-bond packaging and chip scale packaging.

Market Overview

Wafer level packaging (WLP) is a chip scale package (CSP) technology which enables integration of wafer fab, test, packaging and burn-in at wafer level to simplify the manufacturing procedure. With the rising demand of small and quicker consumer electronics, the market is expected to experience positive impact. The broad use of WLP in Radar technology became useful part of self-driving cars. Furthermore, the healthcare industry and wearable devices market would immensely utilize wafer level packaging technology. Advantages of WLP are increased I/O density, reduced form factor, multichip capability, outstanding cost/performance capability and improved electrical & mechanical performance,

Wafer level packaging technology also helps in minimizing the consumption of electricity, has extended battery life for cell phones, and has a compact structure which aids the manufacturers to develop and design ultra-thin cell phones. In spite of all these, there are certain factors which are restraining the growth of the WLP market such as fluctuation in certain physical properties of the WLP technology, like coefficient of thermal expansion of the materials of the wafer technology as compared to the materials of Integrated Circuits (ICs). Coefficient of thermal expansion of materials reduces durability of WLP thus reducing its lifespan which is expected to affect the consumption of WPL since people prefer durable products with long life span as opposed to non-durable products with shorter life-span. The manufacturing cost is major issue which restrain the growth of wafer level packaging market.

Increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are projected to drive the market further.

The global Wafer Level Packaging (WLP) market can be segmented on the basis of integration, technology, application, and region. By integration, it is sub-segmented as integrated passive device, fan in WLP, fan out WLP, and through-silicon via. By technology, it is categorized into flip chip, compliant WLP, conventional chip scale package, wafer level chip scale package, nano wafer level packaging, and 3D wafer level packaging. On the basis of application, it is subdivided into industrial, automotive, medical, consumer electronics, defense, and aerospace. By region, it is categorized as North America, Asia-Pacific, Europe and the Rest of the World. On the basis of process type, it is segmented into Electrochemical Deposition (ECD), Physical Vapor Deposition (PVD), etch, Chemical Vapor Deposition (CVD) and Chemical Mechanical Deposition (CMP). By Product, it is segmented in to 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others which includes 2D TSV WLP and Compliant WLP.

The major players in the market are Jiangsu Changjiang Electronics, Qualcomm Inc, Toshiba Corp, Applied Materials Inc, ASML Holding NV, KLA-Tencor Corration, Siliconware Precision Industries, Marvell Technology Group Ltd, Nanium SA, STATS Chip, PAC Ltd., Amkor Technology Inc, Applied Materials, Inc., Brewer Science, Inc., Deca Technologies, Fujitsu Ltd, Infineon Technologies AG, LAM RESEARCH CORPORATION, China Wafer Level CSP Co. Ltd, Siliconware Precision Industries Co., Ltd, STATS ChipPAC Ltd, Tokyo Electron Limited.

Global Wafer Level Packaging Market Segmentation and Scope

Global Wafer Level Packaging Market is segmented on the basis of integration, technology, application, process type, product, and region as mentioned below:

By Integration

  • Integrated passive device
  • Fan in WLP
  • Fan out WLP
  • Through- silicon via

By Technology

  • Flip chip,
  • Compliant WLP
  • Conventional chip scale package
  • Wafer level chip scale package
  • Nano wafer level packaging
  • 3D wafer level packaging

By Application

  • Industrial
  • Automotive
  • Medical
  • Consumer electronics
  • Defense
  • Aerospace

By Process Type

  • Electrochemical Deposition (ECD)
  • Physical Vapor Deposition (PVD)
  • Etch
  • Chemical Vapor Deposition (CVD)
  • Chemical Mechanical Deposition (CMP)

By Product

  • 3D TSV WLP
  • 2.5D TSV WLP
  • Nano WLP
  • Others
    • 2D TSV WLP
    • Compliant WLP

 By Region

  • North America
    • United States
    • Canada
    • Rest of North America
    • Asia-Pacific
      • China
      • Japan
      • India
      • South Korea
      • Australia
      • Indonesia
      • Rest of Asia Pacific
    • Europe
      • Germany
      • France
      • United Kingdom
      • Italy
      • Spain
      • Russia
      • Rest of Europe
    • Rest of World
      • Latin America
        • Brazil
        • Mexico
        • Rest of Latin America
        • Middle East & Africa

The major players in the market are:

  • Jiangsu Changjiang Electronics,
  • Qualcomm Inc,
  • Toshiba Corp,
  • Applied Materials Inc,
  • ASML Holding NV,
  • KLA-Tencor Corration,
  • China Wafer Level CSP Co. Ltd,
  • Marvell Technology Group Ltd,
  • Siliconware Precision Industries,
  • Nanium SA,
  • STATS Chip,
  • PAC Ltd.
  • Amkor Technology Inc
  • Applied Materials, Inc.
  • Brewer Science, Inc.
  • Deca Technologies
  • Fujitsu Ltd
  • Infineon Technologies AG
  • Siliconware Precision Industries Co., Ltd.
  • STATS ChipPAC Ltd
  • Tokyo Electron Limited
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